Pure Silicon Plasma: Some recent results

A plasma containing only silicon atoms and ions has been obtained by electron-beam evaporation of solid silicon through a helicon rf plasma source, in a Helicon Activated Reactive Evaporation system A (HARE). The density of the silicon plasma in the diffusion chamber is 3 - 5 x 1010 cm-3, and the electron temperature 12 eV. These plasma conditions correspond to a predicted deposition rate from silicon ions of 230 60 nm/minute, comparable to the deposition rate of 250 nm/minute obtained without a plasma.
We have characterised the pure silicon plasma (e-beam power 3.6kw, 1kW of rf power delivered to the helicon plasma source) using Langmuir probes (planar and cylindrical) and optical emission (Monolite OSA). All diagnostics are located at the centre of the top (diffusion) chamber. The pressure measured during operation of the silicon plasma was 6 x 10-6 Torr at the diffusion chamber and 3 x 10-6 Torr at the electron-beam chamber.

Fig.1 shows the I-V characteristic of the cylindrical Langmuir probe. The plasma potential is about 20V; this result is consistent with the plasma potential shown in Fig. 2 for the silicon dominated plasma. The insert in Fig.1 shows the ion saturation current (1.8 mA/cm2) and the floating potential (-40V). These values have been confirmed using a planar disc probe; the ion saturation current measured in that case is 3.2 mA/cm2. The electron temperature estimated from the I-V characteristic is 12 eV, so the ion saturation current gives a plasma density of 3-5 x 1010 cm-3.

The optical emission spectrum plotted in Fig. 2 shows the main emission lines of the excited states of neutral silicon, and two emission lines due to silicon ions (634 and 637nm). No other significant emission lines are observed, showing that the plasma is not contaminated with any other gas.
One of the characteristics of the HARE system is that, due to the spherical expansion of the flux of evaporant, there is a strong gradient in the density of silicon neutrals along the axis of the system9. The values of the neutral density for our evaporating conditions (3.6kW) have been calculated from the measured deposition rate of silicon on a sample located in the top chamber, assuming a directed flux of silicon with an energy of 0.11eV (1300K). For an ideal gas at a temperature of 1300K the silicon atom density of 1012 cm-3 in the plasma source region would correspond to a pressure of 0.14 mTorr. This is slightly less than 0.2 mTorr, which is the minimum pressure at which we are able to maintain an argon plasma.

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